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P2000

Published by PTO

nCORE

Atomic Layer Deposited (ALD) Oxide Semiconductors for Integrated Circuits (ICS)

Mengwei Si (Purdue); Peide Ye (Purdue)
Published by Patent Office
Application Type: Utility

P2004

Published by PTO

nCORE

Cerium-Doped Ferroelectric Materials and Related Devices and Methods

John Baniecki (Stanford); Paul C. McIntyre (Stanford); Balreen Saini (Stanford); Wilman Tsai (Stanford); Yujo Zhouchangwan (Stanford)
Published by Patent Office
Application Type: Utility

P2088

Published by PTO

nCORE

Integrated Circuit With Topological Semimetal Interconnect

Judy J. Cha (Yale); Hyeuk Jin Han (Yale)
Published by Patent Office
Application Type: Utility

P1975

Published by PTO

nCORE

Low-Power Phase Change Memory Technology with Interfacial Thermoelectric Heating Enhancement

Mehdi Asheghi-Roudheni (Stanford); Kenneth E. Goodson (Stanford); Raisul Islam (Stanford); Asir Intisar Khan (Stanford); Heungdong Kwon (Stanford); Eric Pop (Stanford); H.-S. Philip Wong (Stanford)
Published by Patent Office
Application Type: Utility

P2035

Published by PTO

nCORE

Novel Nanocomposite Phase-Change Memory Materials and Design and Selection of the Same

Aaron Kusne (NIST); Mo Li (Univ. of Minnesota); Ichiro Takeuchi (UM/College Park); Changming Wu (Univ. of Washington); Heshan Yu (UM/College Park)
Published by Patent Office
Application Type: Utility

Viewing 1 - 5 of 5

	All current centers
	TxACE	Texas Analog Center of Excellence
	CHIRP	Center for Heterogeneous Integration Research on Packaging
	CDADIC	Center for Design of Analog-Digital Integrated Circuits

	CADTS	Computer Aided Design & Test Sciences 1999–2014
	CSR	Cross-disciplinary Semiconductor Research 1999–2014
	DES	Design Sciences 1982–1998
	DS	Device Sciences 2004–2014
	ES-H	Environmental Safety & Health Sciences 1995–1998
	FAC	Factory Sciences 1995–1998
	ICSS	Integrated Circuit & Systems Sciences 1999–2014
	IPS	Interconnect & Packaging Sciences 2004–2014
	INT	Interconnect Sciences 1995–1998
	LIT	Lithography Sciences 1993–1998
	MFGPS	Manufacturing Process Sciences 1988–1994
	MSS	Manufacturing Systems Sciences 1988–1994
	MPS	Material & Process Sciences 1999–2003
	MBP	Materials & Bulk Processes Sciences 1995–1998
	MIC	Microstructure Sciences 1982–1994
	NMS	Nanomanufacturing Sciences 2004–2014
	NIS	Nanostructure & Integration Sciences 1999–2003
	PKG	Packaging Sciences 1985–1998
	PID	Process Integration & Device Sciences 1995–1998
	SMS	Semiconductor Modeling & Simulation 1995–1998

		Advanced Devices 1994–1995
		Advanced Devices & Technologies 1999–2003
		Advanced Devices & Technologies 2004–2004
	AdvTech	Advanced Technology 1994–1996
	ADS	Alternative Device Structures 1996–1998
	AMS	Analog and Mixed-Signal Devices 2004–2014
		Analysis, Design & Simulation 1994–1995
		Back End Processes 1999–2003
	BEP	Back End Processes 2004–2014
	CFM&TCM	CFM & Total Chemical Management 1995–1998
	CD	Circuit Design 1999–2014
	CM	Compact Modeling 2004–2014
		Contamination Control 1994–1995
	C&S	Controls and Sensing 1996–1998
	CSR	Cross-Disciplinary Semiconductor Research 2015–2016
		Defect Reduction 1997–1998
		Deposition 1994–1995
	DE	Design Environment 1994–1998
	DesSyn	Design Synthesis 1994–1998
	DesTech	Design Techniques 1994–1998
	DV	Design Verification 1994–1998
	DSMS	Device Sciences Modeling & Simulation 2004–2014
	DCMOS	Digital CMOS Technologies 2004–2014
		Doping Technologies 1996–1998
	EP3C	Efficiency and Performance for Connectivity Constrained Computing 2014–2019
	ESH	Environment, Safety, and Health 1995–1998
	ESH	Environment, Safety, and Health 1999–2003
	ESH	Environment, Safety, and Health 2004–2014
		Equip. Auto. and Process Control 1994–1995
	Equip	Equipment 1996–1998
	FAM	Factory Automation & Management 1994–1998
	FacOps	Factory Operations 1997–1998
		Factory Systems 1999–2003
	FACSYS	Factory Systems 2004–2010
	FEOL	FEOL Processes 1996–1998
		Front End Processes 2004–2004
		Heat, Signal, & Power Distribution 1994–1995
	I3T	Innovative and Intelligent Integrated Technology 2014–2020
	ISD	Integrated System Design 1994–2014
		Lithography 1994–1995
	LPD	Logic & Physical Design 2004–2014
		Logic Design 2000–2004
		Masks 1995–1998
		Materials 1995–1998
		Materials & Measurements 1994–1995
	MT	Memory Technologies 2004–2014
		Metrology 1994–1998
	MTMP	Metrology Tools, Matls & Processes 1996–1998
		Modeling & Simulation 1995–1998
		Modeling & TCAD 1996–1998
		Multi-level Interconnect 1994–1995
	NEM	Nanoengineered Materials 2006–2014
	NCR	Non-Classical CMOS Research 2008–2011
		Package & Electrical Design 1996–1998
		Package Reliability 1994–1995
	PKG	Packaging 2004–2014
		Packaging & Interconnect Systems 1999–2003
	PMM	Packaging Materials and Metrology 1995–1998
		Packaging Materials Interfaces 1998–1998
	PMS	Packaging Modeling and Simulation 1998–1998
	Pat(MPS)	Patterning 1999–2003
	PAT	Patterning 2004–2014
	PatMat	Patterning Materials 1996–1998
	PatSys	Patterning Systems 1996–1998
	PhyDes	Physical Design 1994–1998
		Physical Design 1999–2004
		Plasma Etch 1994–1995
		Process Architecture 1996–1998
	PS/E	Process Simplification/Enhancements 1995–1998
	Processes	Processes 1996–1998
		Quality & Reliability 1996–1998
		Reliability 1994–1998
		Resist 1996–1998
		Semiconductor Modeling & Simulation 1999–2001
	SemiSynBio	Semiconductor Synthetic Biology 2013–2021
		Substrates 1995–1998
		Synthesis & Verification 1999–2000
	SLD	System Level Design 2015–2019
		TCAD-MBPS 1996–1998
	TechCAD	Technology CAD 1994–1996
	TT	Test & Testability 1994–1998
	TT	Test & Testability 1999–2014
	TM	Thermal Management 1996–1998
	VER	Verification 2000–2014

	ACE4S	ATIC-SRC Center of Excellence for Energy Efficient Electronics Systems 2013–2018
	CAIST	The New York Center for Advanced Interconnect Science and Technology 2005–2016
	CEMPI	Center for Electronic Materials Processing and Integration 2010–2014
	EBSM	SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 1996–2021
	NCRC	Non-classical CMOS Research Center 2006–2014
	IPC	Georgia Tech Interconnect and Packaging Center 2009–2012

	All current thrusts
	SCARF	Supply Chain AI Realized Future
	IRP	India Research Program

Atomic Layer Deposited (ALD) Oxide Semiconductors for Integrated Circuits (ICS)

Cerium-Doped Ferroelectric Materials and Related Devices and Methods

Integrated Circuit With Topological Semimetal Interconnect

Low-Power Phase Change Memory Technology with Interfacial Thermoelectric Heating Enhancement

Novel Nanocomposite Phase-Change Memory Materials and Design and Selection of the Same

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	CNFD	Center for NanoFerroic Devices 2013–2019
	INDEX	Institute for Nanoelectronics Discovery and Exploration 2006–2019
	SWAN	South West Academy of Nanoelectronics 2006–2019
	Benchmarking	Benchmarking Center 2016–2019
	NRI-NSF	NRI-NSF Research Centers with Supplemental Grants 2006–2019
	E2CDA-NRI	Energy Efficient Computing: from Devices to Architecture 2016–2019
	WIN	Western Institute of Nanoelectronics 2005–2013
	MIND	Midwest Institute for Nanoelectronics Discovery 2008–2013
	NRI-Projects	NRI Projects 2010–2013

	All historical centers
	FAME	Function Accelerated nanoMaterial Engineering 2013–2017
	C-SPIN	Center for Spintronic Materials, Interfaces and Novel Architectures 2013–2017
	LEAST	Center for Low Energy Systems Technology 2013–2017
	C-FAR	Center for Future Architectures Research 2013–2017
	SONIC	Systems On Nanoscale Information fabriCs Center 2013–2017
	TerraSwarm	TerraSwarm Research Center 2013–2017

	MuSyC	Multi-scale Systems Research Center 2009–2013
	GSRC	Gigascale Systems Research Center 1998–2013
	C2S2	Center for Circuits and Systems Solutions 2001–2013
	IFC	Interconnect Focus Center 1998–2013
	MSD	Center for Materials, Structures and Devices 2001–2013
	FENA	Functional Engineered Nano Architectonics 2003–2013