NMP e-Workshop: Quasi-2D Materials for Ultra-low Resistance Interconnects

ABSTRACT:

The resistivity of copper and other 3D metals increases with decreasing electrical interconnect dimensions due to surface scattering. In this talk I will review our work exploring the feasibility of replacing Cu with metallic oxide delafossites, a class of quasi-2D metals. These quasi-2D metals have a cylindrical Fermi surface, resulting in electrons on the Fermi surface having only velocity components in-the-plane of the film. This can only potentially mitigate the increase in resistivity with reducing thickness by preventing the electrons from "seeing" the surface of the film. The 2-dimensional Fermi surface, however, will not offer any protection from sidewall scattering. 

BIO:

Hari Nair is an assistant research professor in Cornell MSE. His group focusses on ultra-wide bandgap semiconductors for next generation power and RF applications and novel materials with unique Fermi surfaces for on-chip electrical interconnects. Most recently, Hari held a research associate position at Cornell University exploring the growth of ruthenate Ruddlesden-Popper thin films using molecular beam epitaxy. This work lead to the first demonstration of superconducting Sr₂RuO₄ thin films in the United States, a goal that eluded researchers for over 20 years. Hari received his Ph.D. in ECE from The University of Texas at Austin. His doctoral work involved molecular beam epitaxy growth of GaSb-based semiconductor alloys to extend the emission wavelength of type-I diode lasers into the 3-5μm range. Hari received his B.Tech. in Engineering Physics from Indian Institute of Technology Madras.