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IEDM Special Poster Session Highlighting SRC Student Innovation

Date:

Tuesday, Dec. 4, 2018, 2 p.m.–4 p.m. PT

Location:

Hilton San Francisco Union Square Golden Gate Ballroom 333 O'Farrell Street, San Francisco, CA, United States

Event ID:

E006630

International Electron Devices Meeting (IEDM) focuses on the areas of materials, devices, processing, metrology, and modeling. These topics are well aligned to those under SRC research. The conference is sponsored by IEEE for its 64th year, and is the flagship conference for these research areas. Latest results are traditionally reported by world-wide renowned researchers here.

A student poster session highlighting fundamental semiconductor research in universities worldwide, sponsored by industry members and government agencies, hosted by SRC.

IEDM Registration Site: https://ieee-iedm.org/program/src-student-showcase/

Poster Listing
Presenter Guidelines

The GaN-on-AlN Platform for Integrated Wide-bandgap Power Electronics	Samuel Bader / Cornell
First Demonstration of Vacuum-sealed Fully Integrated BEOL-compatible Field Emission Devices for Si Integrated High Voltage Applications	Nishita Deka / UCB
Excitonic Devices and Transport Properties	Chelsey Dorow / UCSD
First Transistor Demonstration of Thermal Atomic Layer Etching: InGaAs FinFETs with sub-5 nm Fin-width Featuring in situ ALE-ALD	Wenjie Lu / MIT
Doping Techniques for 2D Materials	Connor McClellan / Stanford
Device-to-System Evaluation Framework for Cognitive Microsystems	Xiaochen Peng / Arizona State
Post-Silicon Layout Sensitivity Mining: A Pathway to Defect-Driven Test Quality and Yield Improvement	Gaurav Rajavendra Reddy / UT Dallas
A Sub-60 mV/dec 2D Strain Field Effect Transistor: 2D-SFET	Daniel Schulman / Penn State
GaN-based Mach-Zehnder Modulators for Highly Efficient Optical Modulation and Switching Applications	Patrick Su / UIUC
Ferroelectric Hafnium Oxide: A Contender for Next-Generation Memory Technologies	Ava Tan / UCB
An Ultra-fast Multi-level MoTe2-based RRAM	Feng Zhang / Purdue
Hyper-Selective Co Metal ALD on Cu and Pt Without Passivation	Steven Wolf / UC San Diego
Multiscale Modeling of the Growth of 2D Functional Materials	Yifan Nie / UT Dallas
Sub-10 nm Diameter InGaAs Vertical Nanowire MOSFETs: Ni vs. Mo contacts	Xin Zhao / MIT
All-Cu Compliant Interconnections for Chip-to-substrate Applications	Kashyap Mohan / Georgia Tech
Novel (nano)materials For Thermal Management of 3D Integrated Circuits	Cagil Koroglu / Stanford
Experimental Demonstration of Ferroelectric Spiking Neurons for Unsupervised Clustering	Zheng Wang / Georgia Tech
Fine-Pitch Integration Technology for Cognitive System Scaling	Zhe Wan / UCLA
Performance Enhancement of Metal-Ion-Threshold Switch (MITS) Selectors	Benjamin Grisafe / Univ. of Notre Dame
Hyper-Dimensional (HD) Computing with Resistive RAM	Haitong Li / Stanford
Research Towards a Multi-level Charge-trap eNVM Fully Compatible with Digital Fabrication Processes	Siming Ma / Harvard Univ.
Zero-Threshold Metallic Rectifier Using Low-Energy Barrier Nano-Magnets	Shehrin Sayed / Purdue

You must register at both the SRC (top-right) and IEDM (see above) registration links.

You must bring your printed poster with you. SRC will not print any posters.

A digital version of your poster should be submitted to SRC, in PDF format.

Posters (one of any size) will be displayed on 8' x 4' tack boards (landscape orientation) see poster-diagrams.

Posters will be attached directly to the tack boards using push pins which will be provided.

Audience should be able to read your poster from four feet away.

IEDM Special Poster Session Highlighting SRC Student Innovation

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