Special Poster Session Highlighting SRC Student Innovation

6-Aug-2018
This all-student poster session showcase at IEDM highlights fundamental semiconductor research in universities worldwide, sponsored by industry members and government agencies. The Semiconductor Research Corporation (SRC) drives advances in materials, devices, processing, metrology, and modeling that are all well-aligned to IEDM’s future.
Tuesday, December 4, 2018 from 2:00pm – 4:00pm in the Golden Gate Room
Poster Names
The GaN-on-AlN Platform for Integrated Wide-bandgap Power Electronics | Samuel Bader / Cornell |
First Demonstration of Vacuum-sealed Fully Integrated BEOL-compatible Field Emission Devices for Si Integrated High Voltage Applications | Nishita Deka / UCB |
Excitonic Devices and Transport Properties | Chelsey Dorow / UCSD |
First Transistor Demonstration of Thermal Atomic Layer Etching: InGaAs FinFETs with sub-5 nm Fin-width Featuring in situ ALE-ALD | Wenjie Lu / MIT |
Doping Techniques for 2D Materials | Connor McClellan / Stanford |
Device-to-System Evaluation Framework for Cognitive Microsystems | Xiaochen Peng / Arizona State |
Post-Silicon Layout Sensitivity Mining: A Pathway to Defect-Driven Test Quality and Yield Improvement | Gaurav Rajavendra Reddy / UT Dallas |
A Sub-60 mV/dec 2D Strain Field Effect Transistor: 2D-SFET | Daniel Schulman / Penn State |
GaN-based Mach-Zehnder Modulators for Highly Efficient Optical Modulation and Switching Applications | Patrick Su / UIUC |
Ferroelectric Hafnium Oxide: A Contender for Next-Generation Memory Technologies | Ava Tan / UCB |
An Ultra-fast Multi-level MoTe2-based RRAM | Feng Zhang / Purdue |
Hyper-Selective Co Metal ALD on Cu and Pt Without Passivation | Steven Wolf / UC San Diego |
Multiscale Modeling of the Growth of 2D Functional Materials | Yifan Nie / UT Dallas |
Sub-10 nm Diameter InGaAs Vertical Nanowire MOSFETs: Ni vs. Mo contacts | Xin Zhao / MIT |
All-Cu Compliant Interconnections for Chip-to-substrate Applications | Kashyap Mohan / Georgia Tech |
Novel (nano)materials For Thermal Management of 3D Integrated Circuits | Cagil Koroglu / Stanford |
Experimental Demonstration of Ferroelectric Spiking Neurons for Unsupervised Clustering | Zheng Wang / Georgia Tech |
Fine-Pitch Integration Technology for Cognitive System Scaling | Zhe Wan / UCLA |
Performance Enhancement of Metal-Ion-Threshold Switch (MITS) Selectors | Benjamin Grisafe / Univ. of Notre Dame |
Hyper-Dimensional (HD) Computing with Resistive RAM | Haitong Li / Stanford |
Research Towards a Multi-level Charge-trap eNVM Fully Compatible with Digital Fabrication Processes | Siming Ma / Harvard Univ. |
Zero-Threshold Metallic Rectifier Using Low-Energy Barrier Nano-Magnets | Shehrin Sayed / Purdue |