CHIMES: Center for Heterogeneous Integration of Micro Electronic Systems

Director: Madhavan Swaminathan
Assistant Director: Muhannad Bakir

CHIMES is a JUMP 2.0 technology center with three primary drivers: 1) Using system architecture metrics to drive new technologies for the center (application-pull) enabling targeted innovations based on system needs; 2) Using technological innovations in the center to enable new system architectures considering system-level tradeoffs across flexible design spaces (technology-push); and 3) Ensuring portability and scalability of the technology components developed in the center, across diverse applications and platforms. CHIMES is organized into four major themes:

  • Theme 1: System Driven Functional Integration & Aggregation
  • Theme 2: Monolithic 3D (M3D) Densification and Diversification on Silicon Platform
  • Theme 3: Ultra Dense Heterogeneous Interconnect and Assembly
  • Theme 4: Materials Behavior, Synthesis, Metrology and Reliability

The cross-center interactions are enabled through Theme I (with JUMP 2.0 System Centers) and Theme II/IV (with JUMP 2.0 Materials & Devices Center).

CHIMES Metrics

  1. Current

    24 Projects
    15 Universities
    90 Research Scholars
    27 Faculty Researchers
    96 Liaison Personnel
  2. This Year

    46 Research Data
    3 Patent Applications
  3. Last Year

    24 Project Starts
    94 Research Data
  4. Since Inception

    24 Projects
    15 Universities
    100 Research Scholars
    29 Faculty Researchers
    122 Liaisons
    140 Research Data
    3 Patent Applications
Updated: 23-May-2024, 12:05 a.m. ET

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