John Oakley, Program Manager

Focusing on advanced packaging solutions for high performance computing, Internet of Things,
and extreme environment applications.


The application drivers for Packaging technologies have evolved significantly as computing devices continue to evolve along a few emerging market vectors:

  • Small, flexible, light, easy-to-use interconnected consumer devices continue to be broadly accepted
  • Cloud based computing, that requires high compute density in Data centers and Servers, continues to become increasingly important
  • Embedded computing that offers greater degree of control in various applications (automotive, commercial and space) grows in scope

In addition, 'green' high performance computing, ergonomic and form factor-challenged mobile applications, new wearable devices & IoT (Internet of Things) applications, and extreme operating environment applications, are all driving new and unique packaging research needs.

The tasks in this research program are divided into two groups; those in a Center and those as individual tasks. The center has been established to address issues directly related to heterogeneous integration of microchips:

CHIRP, Center for Heterogeneous Integration Research on Packaging.


Research Focus

The Packaging thrust focuses on research that addresses emerging application needs for packaging in these areas:

  • Heterogeneous component integration
  • Global interconnects, including optical
  • Power delivery
  • Thermal Management
  • Metrology and modeling
  • Reliability including electromigration
  • Flexible packages
  • Low-cost packages
  • Packaging for automotive and extreme environments
  • Solders and ball grid arrays


Member's Corner

  1. High I/O Bandwidth Density Packaging Research Needs – authored by Dr. Ravi Mahajan, et al.

PKG Metrics

  1. Current

    38 Projects
    23 Universities
    131 Research Scholars
    50 Faculty Researchers
    123 Liaisons
  2. This Year

    222 Research Data
  3. Last Year

    19 Project Starts
    341 Research Data
    2 Patent Applications
  4. Since Inception

    117 Projects
    38 Universities
    375 Research Scholars
    98 Faculty Researchers
    295 Liaisons
    2,033 Research Data
    18 Patent Applications
    1 Patents Granted
Updated: 23-May-2024, 12:05 a.m. ET

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