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CRISP Researcher featured in ACM SIGARCH
Intelligent memory architecture with new memory technologies
SRC In The News
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STARnet, CSPIN Research Featured in Nature Communications
The research describes a fourth ferromagnetic element with magnetic properties at room temperature
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SRC Colloquium on Fabrics of Security
Broaden the scope of industrial and government engagement in fabrics of security to include hardware, architecture, system, network and cloud centric participants.
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JUMP's ComSenTer research featured in IEEE Spectrum
5G may not be here yet. That doesn't stop what comes next.
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One-dimensional quantum materials can deliver record-high current densities
SRC Prof. Alexander Balandin discovered that quasi-1D ZrTe3 nanoribbons reveal an exceptionally high current density, on the order of ∼100 MA/cm2, at the peak of the stressing DC current.
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Researchers developed a novel prevention treatment for Al bond pad corrosion in Cu wire bonded assembly.
NMP Featured Publication: Final Report on Novel Corrosion Prevention Treatments for Cu Wire Bonded Device to Improve Bonding Reliability
Featured Publication
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A metric is defined which quantifies a gate-level IP's trustworthiness by evaluating functional, structural and asset coverage.
T3S Featured Publication: Report on Dynamic Trust Benchmarks and Comprehensive IP Trust Metrics
Featured Publication
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Fundamental studies demonstrate that BTA is highly effective at preventing Al bond pad corrosion in acidic Cl condition.
PKG Featured Publication: Report on Design/Prepare New Corrosion Inhibitors
Featured Publication
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Scalable two-dimensional materials advance future-gen electronics
This work resulted in large area, atomically thin WSe2 films, greatly improved by a number of metrics
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TECHCON 2017 Student wins COMSOL Best Paper award.
SRC student researcher in the GRC research program Logic and Memory Devices wins the Best Paper award on memory (RRAM) device
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TECHCON 2018 Call for Abstracts - Now Open
The deadline for TECHCON 2018 abstract submissions is 3:00 p.m. ET, April 12, 2018.
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SRC/NSF launch efforts in artificial intelligence and human-computing interface
NSF partners with SRC to launch ICA: Intelligent Cognitive Assistants research program to advance AI, create physico-cognitive systems which work collaboratively with humans—needs document available
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SONIC Researchers Reinvent the Inductor after Two Centuries
A third smaller than conventional devices, they might be used in ultra-compact wireless communication systems for applications in IoT, sensing, and energy storage/ transfer. This also highlights a practical application for graphene beyond interconnects. The researchers are looking to make their fabrication processes compatible with BEOL CMOS technology.
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JUMP Announces New Centers
The recently launched JUMP research program announces new research centers
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